Plasmas froids Mott insulator CaTiO3Pr^3^+ Calcined clay AuCu alloy Etching Nanotubes TEM Rutile Atomic layer etching Titanium dioxide Residual stress Band alignment B3 Solar cells Biocapteurs Alzheimer's disease Anatase B2 Semiconducting indium compounds BOMBARDMENT Aluminium nitride Spectroscopic ellipsometry Annealing B2 Quaternary Biomembranes Ambipolar material Ablation laser Low-pressure plasma processing Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation Chalcogenide Magnetron sputtering Scanning electron microscopy Optical waveguides Optical interferometry Amyloid precursor Resistive switching Applications industrielles A Multilayers XPS Band gap PECVD X-ray diffraction Films Transfert d'énergie Buffer Couple Nanocomposite Kirkendall effect Mott insulators A Thin films A1 Characterization Plasma etching NEXAFS B Chemical synthesis Thin film Physical vapor deposition B2 Semiconducting alloys Alloying Capacitance SF 6 Bixbyite Integrated optics Copper 3 nm in size Carbon Thin films A Chalcogenides AlN Sol-gel Semiconductors Avalanche breakdown Non-volatile memory Oxides Structure AZO thin films Biomasse A-CNx TiO2 A3 Physical vapor deposition processes C Photoelectron spectroscopy Transmission electron microscopy X-ray photoelectron spectroscopy Bipolar resistive switching BRS Atomic force microscopy Optical properties CH4 Vanadium Sesquioxide Functionalization CHLORINE PLASMAS CIGSe Amorphous Mass spectrometry Carbon Nanotube Colloidal solution Adsorption Aryl-diazonium salts Selenization CNTs’ collapse Biofilms microbiens Sputtering B1 Inorganic compounds V2O3